13.08.2012 apg2c1 -385 1 / 4 apg2c1 - 385 high power single chip led apg2c1 -385 is a ingan based, high power 3 85 nm single chip led in standard emitter package for general application. specifications ? stru cture: ingan ? peak wavelength: 38 5 nm ? optical outpu t power: typ. 60 mw ? life time: > 10.000 hours ? lead free product - rohs compliant absolute maximum ratings (t a =25c) parameter symbol value unit power dissipation, dc p d 1000 mw forward current, dc i f 500 ma pulsed current (1% duty cycle, 1khz) i fp 1000 ma revers e voltage u r - 5 v operating temperature t opr - 30 ? +70 c storage temperature t stg - 30 ? +85 c soldering temperature (max. 1,5 s) t sol 330 c electro - optical characteristics (t a =25c) parameter symbol condition min. typ. max. unit forward current i f - 350 - ma viewing angle i f = 350 ma - 75 - d eg. cw output power p o i f = 350 ma - 60 - mw peak wavelength p i f = 350 ma - 38 5 - nm forward voltage u f i f = 350 ma - 3.8 - v half width (fwhm) ? i f = 350 ma - 1 8 - nm wavelength measurements tolerance is +/ - 2% ou tput power measurement tolerance is +/ - 10% voltage measurement tolerance is +/ - 2% device materials item material foundation plastic lens silicone resin electrodes agcu heat sink agcu
13.08.2012 apg2c1 -385 2 / 4 typical performance characteristics normaliz ed o utput p ower vs. wavelength : outline dimensions emitter:
13.08.2012 apg2c1 -385 3 / 4 radiation pattern (lambertian lens without optics) relative intensity vs. angular displacement accessories reflectors clp17cr, 6 metalized polycarbonate reflector clp23cr, 20 metalized polycarbonate reflector static electricity leds are very sensitive to static electricity and surge voltage. it is recommended to wear a wristband or an anti - electrostatic glove whenever handling the leds all devices, equipment , and machinery that is used when handling the leds must be grounded properly. heat generation it is advised to operate these leds at a reasonable low temperature for long lifetime and stabili ty. high operating temperature will result in premature degradation and shortened lifetime.
13.08.2012 apg2c1 -385 4 / 4 soldering conditions reflow soldering: apg2c1 leds have a maximum storage temperature of 85. therefor it is not possible to use a reflow soldering proces s for array assembly! hot bar soldering: a hot bar soldering process is recommended when soldering apg2c1 emitters. this process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. in order to transfer suff icient heat from the hot bar to the device, following parameters must be carefully considered: ? amount of flux ? pressing force of solder tip ? hot bar temperature for the standard assembly process, following parameters should be maintained: ? hot bar temperature : 330 c ? force of hot bar. 40 n ? soldering time: 1.5 s it is recommended to use a copper nickel - plated hot bar mounted to standard temperature controlled soldering equipment. manual hand soldering: for prototype build or small series production runs, it is possible to place and solder the emitters by hand. it is therefor e recommended to maintain the following parameters: ? solder tip temperature 330 c ? soldering time. < 1.5 s ? junction temperature must be kept below 70 c a visual inspection may be used to check the quality of the so l d er joint general soldering precautions: ? mechanical stress, shock and vibration must be avoided during soldering ? only use non corrosive flux. ? do not apply current to the device until it has cooled down to room temperature after so ldering.
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